partial financial support from the National Natural Science Foundation of China (No. 52101231);the Science Fund of Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing,China (No. AMGM2021F09);the Natural Science Foundation of Shandong Province,China (No. ZR2021QE044)。
SnAgCu焊点中的金属间化合物(intermetallic compounds,IMCs)Ag_(3)Sn脆性大且电阻高,对焊点可靠性具有重要影响,有必要明确其形成过程和相变机制以控制其生长.采用固体与分子经验电子理论(empirical electron theory,EET)研究Ag-Sn系...
Training Program of Young Scholar in College and University of Henan Province (2017GGJS168);PHD Scientific Research Initial Foundation of Henan Institute of Technology (KQ1848)。