球栅阵列设计对深镀能力的影响探究  

Study on the influence of BGA design on throwing power

作　　者：陈春华 郑宏亮 陈黎阳 Chen Chunhua;Zheng Hongliang;Chen Liyang

机构地区：[1]广州兴森快捷电路科技有限公司智能制造中心,广东广州510663 [2]深圳市兴森快捷电路科技股份有限公司,广东深圳518057 [3]广州兴森快捷电路科技有限公司,广东广州510663

出　　处：《印制电路信息》2021年第S01期230-239,共10页Printed Circuit Information

摘　　要：深镀能力是评估印制电路板电镀铜层状况的一个重要指标。除板厚和厚径比对深镀能力有影响外,孔的密集程度对深镀能力也有重要的影响作用。文章探究设备参数和药水浓度在稳定的状态下,BGA(球栅阵列)矩阵大小、孔壁间距、板厚、厚径比等产品结构对脉冲电镀和直流电镀深镀能力的影响规律,为提高不同产品结构的印制电路板的深镀能力提供技术参考。Throwing power is an important index to evaluate the status of copper plating in PCB.In addition to the equipment parameters and the concentration of the solution,the Product Structure also has an important effect on the Throwing Power.This article explores the influence of Product Structure such as plate thickness,aspect ratio,hole wall spacing,and number of BGA holes on the throwing power under stable conditions of equipment parameters and chemical concentration,and uses multiple regression analysis method,the mathematical model between the product structure and the throwing power was established,which provide technical reference for digital operation of intelligent factory.

关 键 词：球栅阵列 产品结构 脉冲电镀 直流电镀 深镀能力 

分 类 号：TN41[电子电信—微电子学与固体电子学]