高可靠先进微系统封装技术综述  

An Overview of High Reliability Advanced Microsystem Packaging Technologies

作　　者：赵科[1] 李茂松[2] ZHAO Ke;Li Maosong(The 26th Research Institute of China Electronics Technology Group Corporation,Chongqing 400060,P.R.China;The 24th Research Institute of China Electronics Technology Group Corporation,Chongqing 400060,P.R.China)

机构地区：[1]中国电子科技集团公司第二十六研究所,重庆400060 [2]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2023年第1期115-120,共6页Microelectronics

基　　金：模拟集成电路国家级重点实验室基金资助项目(614280204030317)

摘　　要：在人工智能、航空航天、国防武器装备电子系统小型化、模块化、智能化需求驱动下,系统级封装设计及关键工艺技术取得了革命性突破。新型的系统封装方法可把不同功能器件集成在一起,并实现了相互间高速通讯功能。封装工艺与晶圆制造工艺的全面融合,使封装可靠性、封装效率得到极大的提升,封装寄生效应得到有效抑制。文章概述了微系统封装结构及类型,阐述了高可靠晶圆级芯片封装(WLP)、倒装焊封装(BGA)、系统级封装(SIP)、三维叠层封装、TSV通孔结构的实现原理、关键工艺技术及发展趋势。Driven by the demand of electronic equipment miniaturization,modularization and intelligence for artificial intelligence,aerospace and defense weapons,revolutionary breakthroughs have been made in microsystem packaging technology design and critical process.Novel system level packaging technologies allow integrated devices to work together and communicate at very high speeds.With the full integration of the package and wafer process,the packaging reliability and efficiency have been greatly improved,and the parasitic is significantly reduced.In this paper,the structures and types of microsystem packaging were summarized.The realization method and critical technology of high reliable wafe-level package,ball grid array(BGA)package,system in package(SIP),three-dimensional(3D)stacked packaging and TSV process were discussed,and the developing trends were given.

关 键 词：系统级封装 晶圆级封装 倒装焊BGA封装 2.5D/3D叠层封装 通孔技术 

分 类 号：TN305[电子电信—物理电子学]