无铅焊点在跌落冲击载荷下动态特性研究  

Dynamic Study of Lead-free Solder Joint under Drop Impact

作　　者：周新[1] 刘芳[1] 周海亭[1] 赵玫[1] 赵峻峰[2] 

机构地区：[1]上海交通大学机械系统与振动国家重点实验室,上海200240 [2]英特尔技术开发(上海)有限公司,上海200181

出　　处：《噪声与振动控制》2007年第4期1-3,18,共4页Noise and Vibration Control

基　　金：英特尔技术开发(上海)有限公司资助项目

摘　　要：针对JEDEC标准板的局限性,设计一种圆形PCB,建立其三维有限元模型,运用ABAQUS有限元分析软件对设计板在跌落冲击载荷下的动态特性进行模拟仿真,找到封装中焊点的薄弱环节,得出焊点的应力状况与PCB板的挠曲变形存在一致的对应关系,验证PCB板在跌落冲击过程中弯曲振动导致的交变应力是焊点破坏的原因。Due to the limitation of JEDEC standard board,a round printed circuit board(PCB) was designed.A 3-D FE model was established in order to investigate dynamic responses of the round PCB and find the weakness of solder joint in packaging under drop impact.The relationship between the stress conditions of solder joints and PCB bending verified that failure cause of solder joints was the alternative stress induced by PCB′s bending vibration under drop impact.

关 键 词：振动与波 无铅焊点 跌落冲击 可靠性 

分 类 号：TB115[理学—数学]