微陀螺仪的真空回流封装工艺研究  

Research on Vacuum Packaging of Micro-gyroscope with Vacuum Reflow Furnace

作　　者：刘文明[1] 王志勇[1] 鲍剑斌[1] 汪学方[1] 关荣峰[1] 朱福龙[1] 刘胜[1] 

机构地区：[1]武汉华中科技大学微系统研究中心,武汉430074

出　　处：《微细加工技术》2006年第2期61-64,共4页Microfabrication Technology

摘　　要：利用热传导理论,对微陀螺仪在真空回流炉中的封装过程进行了数值模拟,得到了当焊料熔化时,加热台台面与微陀螺仪的焊料层的温度梯度值约为30℃,然后根据数值计算结果设计,并在自行研制的真空回流封装炉进行了微陀螺仪封装实验。通过对实验结果进行分析,获得了微陀螺仪在真空回流炉中封装的最佳工艺参数,即在微陀螺仪上施加0.7 N的正压力,加热台按照设定曲线加热到350℃,保持恒温时间5 min,使焊料达到最佳熔化状态。研究结果对微陀螺仪真空封装时工艺参数的优化以及提高采用金锡焊料封装的可靠性和耐久性具有指导意义。The packaging process of micro-gyroscope and its technological parameters are investigated. Based on the heat transfer theory, the packaging process in the vacuum furnace is simulated, and the difference between the heating-up table and the AuSn solder is calculated to be less than 30°C when the solder is melted. According to the calculated results, the experiment of packaging micro-gyroscope has been carried out successfully in the self-developed vacuum reflowing furnace. By analysing the experiment results, optimum packaging processing parameters are obtained. To apply an external pressure of 0.7 N on every micro-gyroscope in a 6-chip fixture, the solder material is just in the melting when the heating stage is heated to 350°C along with the heating curve. All the results could be used to further optimize the process parameters of packaging micro-gyroscopes and other MEMS devices in the vacuum furnace and to improve the yield, reliability and durability of packaging with AuSn solder.

关 键 词：微陀螺仪 真空封装 回流工艺 数值模拟 

分 类 号：TN305.94[电子电信—物理电子学]