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作 者:杨杰伟[1] 吴一辉[1] 王淑荣[1] 张平[1]
机构地区:[1]中国科学院长春光学精密机械与物理研究所应用光学国家重点实验室
出 处:《微细加工技术》2006年第3期27-31,共5页Microfabrication Technology
基 金:国家自然科学基金资助项目(60574089);中国科学院创新项目资助
摘 要:为了在平面微电机有限大尺寸的定子上制作高深宽比结构的绕组线圈,对高深宽比微结构的制作工艺进行了研究,综合比较各方面因素,从中找出了成品率高、可重复性好、工艺步骤尽量简单的平面线圈制作工艺,即在硅沟槽里通过微电铸得到高深宽比平面铜线圈的深刻蚀成型电铸工艺,并分析了光刻工艺关键参数之间的关系及对后续工艺的影响。通过该工艺制作的直径为10 mm的定子线圈深宽比大(宽40μm、深80μm),无空洞,并且在工艺上还有很大的深宽比挖掘潜力。该工艺亦可应用于其他需要高深宽比平面线圈的微执行器的制作中。Various processes of microstructures were studied to fabricate high-aspect-ratio winding coil on the stator coil of a planar micromotor. Analyzing a number of factors, a fabrication process called as deep etching-molding-electroplating technique was obtained, with which the planar copper coil was formed by electroplating the seed layer in the silicon trench with high-aspect-ratio. It has a good reproducibility and a simple procedure. Simultaneously, the relationships among the key parameters during the photolithography processes were analyzed. The planar stator coil with a diameter of 10 mm fabricated by the technique has a good high-aspect-ratio (40 μm in width, 80 μm in depth) and is free of voids. Moreover, the technology has a good potential for obtaining higher aspect ratio. It can be used for fabrication of high-aspect-ratio planar coil of other microactuators.
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