超薄覆铜箔层压板耐电压检测技术  

Technology for Ultra-thin Copper Clad Laminate Hi-pot Test

作　　者：钟健伟[1] 黄伟壮[1] 温东华[1] 韩彦峰[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《材料工程》2009年第S2期93-96,共4页Journal of Materials Engineering

摘　　要：在超薄覆铜板的测试项目中引入耐电压测试,设计了一套符合覆铜板特点的耐电压测试装置,借由这套装置开展了对耐电压测试条件和影响因素的研究。通过应用试验发现:直流电压下耐电压失效多发生于升电压阶段,升电压速率是影响直流耐电压测试的关键条件;交流电压下耐电压失效与电压保持时间紧密关联;可以利用交流电压下的漏电电流,量化衡量超薄覆铜板的绝缘能力;树脂含量、绝缘厚度、基材杂质、基材空洞、环境湿度、铜箔粗糙度都是覆铜板耐电压能力的影响因素。Introduce Hi-pot test into ultra-thin laminate test envelope to research the influence of test condition,design a set of Hi-pot test instrument available for ultra-thin laminate.It's found through the applied experiment that under DC,voltage breakdown happens most at voltage step-up stage,and voltage step-up rate is the main factor of Hi-pot test applied with DC,whereas voltage maintenance time plays an important part in Hi-pot test applied with AC.The insulation ability of ultra-thin laminate would be quantified by the leaking current in Hi-pot test applied with AC.It's also found that resin content,dielectric thickness,foreign material,void,environmental humidity and copper foil profile are influence factors of laminate breakdown voltage.

关 键 词：耐电压 覆铜板 电流 失效 影响因素 

分 类 号：TN41[电子电信—微电子学与固体电子学]