盲埋孔印刷线路板的设计与制作技术  

The Design and Manufacture Technology of Blind and buried Via PCB

作　　者：刘东 

机构地区：[1]深圳崇达多层线路板有限公司

出　　处：《印制电路信息》2009年第S1期550-556,共7页Printed Circuit Information

摘　　要：HDI、盲埋孔PCB产品因为其可实现高密度、小尺寸的布线而成为目前PCB应用的主流产品之一。不少厂家都将未来的产品发展方向锁定在HDI、盲埋孔产品上,并为此投入了大量资金以购买先进的设备。本文针对HDI、盲埋孔的类别、设计方法进行了详述,并其技术难点分别提出了解决方案。可帮助读者清晰的了解这些产品的特性和制作方法。High density interconnected(HDI),Blind & Buried via PCB products have become the main stream of PCB application currently,because of their high density and small dimension-lined specification. Lots of manufacturers focus their plan for future products development on the HDI,Blind & Buried via products and invest a great sum of money in buying advanced equipment.This thesis introduces the range of HDI、Blind & Buried via and its design method in great details.Finally,this thesis puts forward some separate solutions to the technology difficulties,in the hope of helping the readers understanding the characteristics and producing methods of the products clearly.

关 键 词：埋孔 PCB HDI 激光钻孔机 盲孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]