孔、线共镀铜工艺研究与优化  

Research and optimization of through holes and fine lines with simultaneous electroplating

作　　者：何杰[1] 何为[1] 陶志华[1] 冯立[1] 徐缓 周华 李志丹 郭茂贵 

机构地区：[1]电子科技大学,四川成都610054 [2]博敏电子股份有限公司,广东梅州514000

出　　处：《印制电路信息》2013年第S1期110-115,共6页Printed Circuit Information

基　　金：广东省科技厅产学研结合项目(项目编号:2012A090300007)

摘　　要：应用孔线共镀铜工艺,制作了板厚1.5 mm、孔径200 m的导通孔及线宽、线距均为50 m的精细线路。用正交试验法的L16(45)正交表安排CuSO4、H2SO4、添加剂a、b的浓度四因素进行电镀试验,选取导通孔的深镀能力、精细线路的结合力和镀层的光亮性作为实验指标。通过对三个指标的综合分析,试验得到了最佳的电镀药液配方:CuSO4、H2SO4浓度分别为45 g/L及220 g/L,添加剂a和添加剂b的浓度为0.6 ml/L及20 ml/L。Through holes with thickness at 1.5 mm and diameter at 200 μm, the hole and ifne lines with width and pitch both at 50 μm were manufactured through simultaneous electroplating. In the study L16(45)orthogonal arrangement was used to take the orthogonal experiment and four factors included, concentrations of CuSO4, H2SO4, additive a and b, respectively. Meanwhile, the throwing power of through holes, the binding force of ifne lines and the brightness of plating were chosen as experimental indexes. After comprehensive consideration of the three experimental indexes, the optimum prescription of the electroplating liquid were obtained:the concentrations of CuSO4, H2SO4, additive a and b are 45 g/L, 220 g/L, 0.6 ml/L and 20 ml/L, respectively.

关 键 词：孔线共镀 优化试验法 导通孔 精细线路 电镀铜 

分 类 号：TN41[电子电信—微电子学与固体电子学]