微电子封装技术在对SMT促进中的作用  

Promotion of SMT on Microelectronic Packaging

作　　者：况延香[1] 朱颂春[1] 

机构地区：[1]中国电子科技集团公司第43所,安徽合肥230022

出　　处：《电子工业专用设备》2004年第9期48-52,共5页Equipment for Electronic Products Manufacturing

摘　　要：SMD是SMT的三要素之一,并为SMT的基础;而微电子封装技术,特别是先进IC封装技术又是SMD的基础与核心,并深刻地影响着SMT其它要素--SMT设备和SMT工艺技术的发展与提高,从而推动SMT向更高层次发展。重点论述了微电子封装技术,特别是先进IC封装技术对SMT的挑战与推动。SMD is one of the three elements of SMT,and is a basis for SMT;while microelectronic packaging especially the advanced IC packaging serves as a basis and core of SMD,and has a profound impact on the other elements of SMT-SMT equipment and the development and promotion of SMT,which therefore pushes SMT forward to a higher lever. Expound the microelectronic technology,in particular the challenge and promotion of SMT made by IC technology.

关 键 词：微电子封装 先进IC封装 SMD SMT 

分 类 号：TN305.94[电子电信—物理电子学]