一种新型微变形镜键合技术  

The bonding process for a novel micro-deformable mirror

作　　者：余洪斌[1] 陈海清[1] 竺子民[1] 李俊[1] 张大成[2] 李婷[2] 

机构地区：[1]华中科技大学光电子工程系,湖北武汉430074 [2]北京大学微电子学研究所微米/纳米加工技术国家重点实验室,北京10087

出　　处：《光电工程》2004年第8期12-14,22,共4页Opto-Electronic Engineering

摘　　要：对一种新型可变形反射镜加工中的硅-玻璃阳极键合工艺进行了研究。设计了一种通过导线将压焊点引至键合区的特殊结构,使得键合过程中台柱与驱动电极保持等电势,从而有效避免了电极和结构之间的相互作用所引入的缺陷,使得最终获得的驱动电极的有效面积接近100%。针对键合前后气体体积收缩导致的镜面凹陷问题,提出在玻璃上加工出贯穿器件的浅槽结构。实验结果表明,在380C,1atm的环境下施加-1000V电压进行阳极键合时,当浅槽深度大于200nm时,将获得较好的镜面质量。The silicon-glass anodic bonding process for a novel deformable mirror is discussed in this paper. A special structure is designed to avoid the electrode defect caused by the interaction between actuators and structure, in which the pad is extended to the bonding region through a wire making zero potential between the actuator and the pillar during bonding. As a result, the fabricated effective surface of electrode is nearly 100%. In view of the convex and concave on mirror surface induced by air volume shrinkage before and after bonding, a shallow trenches structure through the device are also fabricated on glass. The experimental results show that when anodic bonding is carried out under the condition of 380C, one atmospheric pressure, and 1000 voltage and the depth of shallow trench more than is 200nm, a better mirror quality can be obtained.

关 键 词：变形镜 键合 静电力 

分 类 号：TN256[电子电信—物理电子学]