化学镀铜中Cu(Ⅱ)-EDTA电还原机理  

Mechanism of Cu(Ⅱ)-EDTA Electroreduction in Electroless Copper Plating

作　　者：黄树坤[1] 邝少林[1] 

机构地区：[1]湖南大学化学化工系

出　　处：《湖南大学学报（自然科学版）》1993年第1期51-56,共6页Journal of Hunan University:Natural Sciences

摘　　要：用极化曲线、旋转电极、计时电位法与计时电量法研究了化学镀铜中Cu(Ⅰ)-EDTA电还原机理.反应级数测定的结果表明Cu(Ⅰ)电还原服从C. E机构,电化学步骤为电极反应的控制步骤.电活性粒子为吸附于电极表面的、由异相前置化学转化而活化的Cu-EDTA^(2-)粒子.The mechanism of electrochemical reduction for species Cu(I)-EDTA in eiectroless copper plating was studied by means of polarization curve,rotating disc electrode,chrono-potentiometry and chronocoulometry.The result of reaction order determination indicated that C. E. reaction scheme was obeyed and electron transfer was rate determining stage of over-all reaction. The absorbed complexes CuL^3 (L=EDTA) could act as electroactive species,which was activated by preceding surface transformation.

关 键 词：化学还原镀 镀铜 化学镀铜 电还原 

分 类 号：O646.54[理学—物理化学]