基于法布里珀罗微腔阵列的光读出红外热成像器件设计与制作  

Design and Fabrication of Optically Readable Infrared Thermal Imaging Device Based on Fabry-Perotw Micro-Cavity Array

作　　者：冯飞[1] 焦继伟[1] 熊斌[1] 王跃林[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所传感技术国家重点实验室,上海200050

出　　处：《光学学报》2004年第10期1375-1380,共6页Acta Optica Sinica

基　　金：国家 973计划集成微光机电系统研究 (G19990 3310 1)资助课题

摘　　要：提出了一种新颖的基于硅基法布里珀罗微腔阵列的光读出红外热成像器件 ,该器件利用光学读出技术将红外图像直接转化为可见光图像 ,其焦平面阵列 (FPA)是一个基于微机电系统 (MEMS)制作的法布里珀罗微腔阵列。阐明了器件的工作原理 ;完成了可动微镜结构、热机械、可见光读出部分设计。理论分析表明 ,对Al/SiO2 双材料体系而言 ,SiO2 厚度应大于 0 .3μm ,其最佳厚度比为 0 .5 98,相应的最大热 机械灵敏度可达 10 -8m/K。采用体硅微机电系统技术 ,实验制作出了 5 0× 5 0焦平面阵列。This paper presents the design and fabrication of a novel optically readable thermal imaging device based on Fabry-Perot micro-cavity array made on silicon substrate, which directly translates thermal imaging into visible imaging by using optically readable technology. The focal plane array(FPA) of this device is a Fabry-Perot micro-cavity array based on microelectromechanical system (MEMS) technology. The structure and thermo-mechanical designs of movable micromirror, and the design of the visible readable setup are completed. Theoretical analysis indicates: the thickness of SiO 2 should be thicker than 0.3 μm, optimal thickness ratio of Al/SiO 2 is 0.598 and corresponding thermo-mechanical sensitivity can reach 10 -8 m/K for the bi-material beams made of Al and SiO 2. The FPA containing 50×50 Fabry-Perot micro-cavity array has been successfully fabricated by using bulk MEMS technology and demonstrated.

关 键 词：光读出热成像 法布里-珀罗微腔 微机电系统 热-机械灵敏度 

分 类 号：TN216[电子电信—物理电子学]