因材料和工艺而异的常规通孔技术  

Standard Through-Hole Technologies as a Function of Materials and Processing

作　　者：张伯兴[1] 吴梅珠[1] 

机构地区：[1]江南计算技术研究所,214083

出　　处：《印制电路信息》2004年第9期33-39,42,共8页Printed Circuit Information

摘　　要：在亚洲和欧洲HDI技术广泛应用于消费级电子产品,如便携式无线通讯设备、计算机、数码成像和芯片安装等。虽然在这方面,北美一直都比较落后,但是HDI仍将在北美市场备受瞩目。正因为这样,PCB制造商必须有能力制造精细线路和间距,同时有能力进行微孔成型和小孔电镀。 本文分两部分,将就与微孔相关的原料和成型工艺来探讨微孔的热可靠性和常见的通孔。互连可靠性将用多种方法来测试,包括标准热冲击测试、互连应力测试(IST^(TM))和以空气为介质的热循环。High Density Interconnect (HDI) technologies are being used widely in Asia and Europe in consumer electronics for portable wireless communication and computing, digital imaging, and chip packaging. Although North America lags behind in developing process capability for this technology, HDI will become a significant business segment for North America. For this to happen, the printed circuit board shops will have to become process capable in fabricating fine lines and spaces, and also be capable in forming and plating microvias. This two-part paper will look at the thermal reliability of microvias and standard vias in relation to the materials and processes in which by they are created. The reliability of the interconnect is measured using several different techniques including standard thermal shock, Interconnect Stress Testing (IST^(TM)), and air-to-air thermal cycling.

关 键 词：通孔 互连 HDI技术 热可靠性 精细线路 无线通讯 芯片 PCB制造商 北美市场 消费 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN41