电真空器件用陶瓷二次金属化镀镍层起泡现象的研究  

Blistering due to secondary metallization of Ni-coating of ceramics applied to electronic vacuum

作　　者：杨卫英[1] 伍智[1] 邹桂娟[1] 曾敏[1] 

机构地区：[1]中国工程物理研究院电子工程研究所,四川绵阳621900

出　　处：《真空》2005年第1期50-52,共3页Vacuum

摘　　要：陶瓷二次金属化镍层烧结后起泡是影响产品质量和合格率的一个主要因素,本文针对陶瓷的一次金属化和二次金属化工艺,经XPS、XRF、SEM等方法分析,得出:陶瓷的二次金属化起泡与其沉积层的基材和沉积层的厚度有关,陶瓷一次金属化烧结后钼的特殊形貌——钼颗粒较大、颗粒之间结合疏松和钼的电化学特性,决定钼上的沉积层厚度必须在合适范围内——4～9μm,才能减小沉积层中的应力,保证烧结后镍层与钼有良好的结合力。The blistering of Ni-coating of ceramics after sintering due to secondary metallization is a main influencing factor on the quality even acceptable standard of products. Such testing means as XPS, XRF and SEM were used to analyze the primary and secondary metallization or sintering processes, and the results indicated that the blistering of Ni-coating of ceramics relates to the thickness of Ni-Mo substrate used and deposited layer or coating on it. The big particle size, porous structure and electrochemical properties of molybdenem feature the special morphology of sintered ceramic surface layer after primary metallization, which implies that the thickness of deposited film on substrate has to be in an appropriate range of 4～9 μm so as to decrease its internal stress and provide higher bonding force between sintered Ni-coating and Mo contained in substrate.

关 键 词：陶瓷 金属化 起泡 厚度 应力 

分 类 号：TB743[一般工业技术—材料科学与工程] TB43[一般工业技术—真空技术]