用于混合微电子封装的聚合物粘接材料  

Polymer Adhesive Materials for Hybrid Microelectronics Packaging

作　　者：李自学[1] 

机构地区：[1]西安微电子技术研究所,陕西西安710054

出　　处：《电子元器件应用》2005年第2期43-45,共3页Electronic Component & Device Applications

摘　　要：结合微电子封装技术的发展,重点叙述用于混合微电子封装的聚合物粘接材料的组成、分类及聚合物可靠性实验的研究情况。同时,介绍国外关于导电类粘接材料导电机理的研究现状及进展。The composition, sorting and reliability of polymer adhesive materials for hybrid microelectronics packaging are mainly described in conjunction with development of microelectronic package. At the same time, the research status and development about mechanism of conductive adhesive materials in foreign companies are introduced.

关 键 词：封装 粘接 聚合物 混合集成电路 

分 类 号：TN305.94[电子电信—物理电子学]