埋入电子元件基板的技术动向  

Technology Trend of Electronic Component Embedded Substrate

作　　者：蔡积庆[1] 

机构地区：[1]南京无线电八厂

出　　处：《印制电路信息》2003年第10期44-48,64,共6页Printed Circuit Information

摘　　要：概述了埋入无源元件陶瓷基板,集成无源元件(IPD)硅基板,埋入无源部品或者无源部品和有源部品的树脂基板的技术动向。它适应于21世纪安装技术的革新。This paper is describes the technology trend of passive component embedded ceramic substrate, integrated passive device(IPD)Si substrate, passive Component embedded or passive and active component embedded resin substrate. It is suitable to revolutionization of mounting technology in 21th century.

关 键 词：电子元件 陶瓷基板 集成无源元件 硅基板 树脂基板 技术动向 安装技术 印制电路板 

分 类 号：TN405[电子电信—微电子学与固体电子学]