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作 者:鲁武 顾宁[1] 韦钰[1] 沈浩瀛[2] 张岚[2]
机构地区:[1]东南大学,南京210018 [2]南京电子器件研究所,南京210016
出 处:《电子科学学刊》1994年第6期651-654,共4页
摘 要:应用LB技术制备了厚度为20—100nm的聚甲基丙烯酸甲酯(PMMA)超薄高分辨率电子束抗蚀层。应用改装的日立S-450扫描电子显微镜(SEM),研究了PMMALB膜的曝光特性和刻蚀条件。结果得到线宽0.15μm的铝掩模光栅图形,表明此种超薄膜具有良好的分辨率和足够的抗蚀性。Ultra-thin (20-100nm) polymethylmethacrylate (PMMA) films prepared by Langmuir-Blodgett techniques have been explored as high resolution electron beam resists. A Hitachi S-450 scanning electron microscope (SEM) has been refitted for a high resolution electron beam exposure system. The lithographic properties and exposure conditions of LB PMMA films were investigated. 0.15um lines-and-spaces patterns were achieved by using the SEM as the exposure tool. The results demonstrate that the etch resistance of such films is sufficiently good to allow patterning of a 20-nm aluminum film suitable for mask fabrication.
分 类 号:TN405.98[电子电信—微电子学与固体电子学]
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