CAD技术在电子封装中的应用及其发展  

Application and Development of CAD in electronic Packaging

作　　者：谭艳辉[1] 许纪倩[1] 

机构地区：[1]北京科技大学机械工程学院,北京100083

出　　处：《电子与封装》2005年第2期5-11,共7页Electronics & Packaging

摘　　要：现代电子信息技术的发展,推动电子产品向多功能、高性能、高可靠性、小型化、低成本的方向发展,微电子封装、IC设计和IC制造共同构成IC产业的三大支柱。计算机辅助设计(CAD)作为一种重要的技术手段在IC产业中发挥了巨大作用,已广泛应用于电子封装领域。本文结合各个时期电子封装的特点,介绍了封装CAD技术的发展历程,并简要分析了今后发展趋势。The development of modern electronic information technology promotes electronic product becoming multi-function, high-performance, high-reliability, miniaturization and low-cost. Computer-aided design (CAD) as an important technology has been exerting an important function on IC industry and has been applied to electronic packaging area widey. With the feature of the electronic packaging in different steps, the development of the electronic packaging CAD were discussed and the trend was chiefly analyzed in this paper.

关 键 词：CAD 电子封装 组装 芯片 

分 类 号：TN305.94[电子电信—物理电子学] TP391.72[自动化与计算机技术—计算机应用技术]