低温共烧多层陶瓷基板烧结收缩控制技术  

Shrinkage Control Technologies for Low Temperature Co-fired Multilayer Ceramic Substrate

作　　者：孙义传[1] 章瑜[1] 徐政[2] 

机构地区：[1]电子部四十三所 [2]同济大学材料系

出　　处：《现代技术陶瓷》1994年第1期35-38,共4页Advanced Ceramics

摘　　要：低温共烧多层陶瓷基板烧结收缩率的控制很重要,本文通过控制粉料粒度、流延粘合剂比例、热压叠片压力和烧结曲线等,可将收缩率控制在14％±0.4％内。It is very important to control shrinkage for low temperature co-fired multilayer ceramic substrate.In this paper, shrinkage control factors are mainly partidesize; pressure on lamination) binder content in slurry and temperature profile at sintering. Shrinkage can be controlled to 14.0%±0. 4%, by shrinkage control technology.

关 键 词：陶瓷基板 烧结 收缩控制 电子陶瓷 

分 类 号：TQ174.756[化学工程—陶瓷工业]