玻璃基板上硅薄膜附着力的研究  

INVESTIGATION ON ADHESIVE POWER OF SILICON FILM TO GLASS SUBSTRATE

作　　者：朱建强 姜英娜 宋晨路[2] 韩高荣[2] 

机构地区：[1]威海蓝星玻璃股份有限公司,威海市264205 [2]浙江大学无机非金属材料研究所,杭州市310027

出　　处：《玻璃》2005年第2期3-4,21,共3页Glass

摘　　要：采用APCVD工艺,以SiH4为原料在不同温度的玻璃基板上硅质薄膜的制备,采用划痕法测量薄膜与基板之间的附着力,研究了薄膜附着力随基板温度变化趋势。说明了吸附、扩散的增强以及沉积速率的增大等都会导致薄膜附着力的增加。On different temperature glass substrates silicon film is prepared by APCVD process . SiH4 is used as the starting materials . The adhesive power between silicon film and glass substrate is measured by scratch test . The adhesive power is calculated from the critical load and width of scratch . The change trend of adhesive power with substrate temperature is also investigated . The enhancement of ad sorption . diffusion as well as increment of deposition rate will make film adhere firmlv to its substrate .

关 键 词：玻璃基板 附着力 硅薄膜 cVD工艺 SIH4 变化趋势 基板温度 沉积速率 划痕法 硅质 

分 类 号：TQ171.73[化学工程—玻璃工业] TN304.12[化学工程—硅酸盐工业]