数字显示电路的设计与多芯片组件封装实现  

Design and MCM packaging of a digital metrical circuit

作　　者：畅艺峰[1] 杨银堂[1] 柴常春[1] 马涛[1] 

机构地区：[1]西安电子科技大学微电子所宽禁带半导体材料与器件教育部重点实验室,陕西西安710071

出　　处：《电路与系统学报》2005年第3期129-131,共3页Journal of Circuits and Systems

基　　金：国防预研基金项目(41323020204)

摘　　要：由于MCM自身的特点,物理设计已成其瓶颈问题。本文在已有方案的基础上,设计实现了一个数字显示电路,并计算了各单元电路的相关参数,最后对电路进行多芯片组件(MCM)封装。仿真结果表明,该电路的最大电容量和响应时间等参数均能满足电路设计的要求。Physical design has become a bottleneck problem because of the features of multichip modules (MCMs). Based on the existing design method, a capacitor digital metrical circuit is produced through improving the counting control circuit and calculating the related circuit parameters. MCM package is applied in circuit in order to realize higher package density and work frequency. The MCM packaging simulation results show that the maximum measurable capacitance and response time can meet the practical requirements.

关 键 词：多芯片组件 封装 仿真 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]