低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响  

Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint

作　　者：马孝松[1] 陈建军[1] 

机构地区：[1]西安电子科技大学电子机械系

出　　处：《机械设计与研究》2005年第3期68-70,共3页Machine Design And Research

基　　金：国家自然科学基金资助项目(60166001)

摘　　要：采用了填充碳纤维、二氧化硅(Silica)的环氧树脂倒装焊底充胶,因为碳纤维具有负热膨胀系数,比单独填加了二氧化硅的底充胶热膨胀系数低很多,仿真和实验结果表明焊点的热疲劳寿命比填充普通的环氧树脂底充胶大大提高。又与Engelmaier提出的焊点寿命预测模型[E W]进行了比较,结果表明Coffin Manson形式的焊点疲劳寿命模型比实际寿命估计得要高。Carbon fiber and silica filled epoxy is studied as underfill in flip chip.Because of the negative thermal expansion coefficient of carbon fiber,this underfill has much lower thermal expansion coefficient than that of silica filled epoxy or epoxy underfill. Simulation and experiment results prove that it can greatly increase the faigue life of flip chip solder joints than that of silica filled epoxy or only epoxy itself as underfill.Compared with Engelmaier's solder joints prediction fatigue life model,Coffin-Manson's model is highly evaluated than that of[E-W]model and practical experimental fatigue life.

关 键 词：热膨胀系数 电子封装 疲劳 底充胶 倒装焊 

分 类 号：TN605[电子电信—电路与系统] TK124[动力工程及工程热物理—工程热物理]