微力学测试仪在MEMS键合强度测试中的应用  

APPLICATION OF SUPER MICRO TESTER IN MEMS BONDING STRENGTH TEST

作　　者：郇勇[1] 张泰华[1] 杨业敏[1] 阮勇[2] 张大成[2] 

机构地区：[1]中国科学院力学研究所非线性力学国家重点实验室 [2]北京大学微电子学系MEMS工艺研究室,北京100871

出　　处：《机械强度》2005年第3期331-334,共4页Journal of Mechanical Strength

基　　金：国家自然科学基金项目(10372103;10432050);中科院知识创新工程项目(KJCX2SWL2);国家重大基础研究项目(G1999033108);国家高技术研究发展计划(2002AA04420)资助项目。~~

摘　　要：研制微力学测试仪,对微电子机械系统中键合结构的强度进行测试。最大载荷为1.4N,在载荷量程为450mN时仪器的最高分辨力为10μN。采用键合在玻璃基底上的硅悬臂梁作为试样。为模拟横力剪切破坏和扭转破坏工况,用微力学测试仪分别在悬臂梁的固定端和自由端施加载荷至试样破坏。测得相应的破坏载荷并计算出最大剪应力。对破坏残骸的显微观察发现,存在玻璃开裂和硅开裂2种失效模式。该技术为微电子机械系统(microelectromechanicalsystem,MEMS)键合结构的强度表征提供一种有效方法,并可用来进行微悬臂梁或微桥的强度测试。An instrument named Super Micro-Tester (SMT) has been designed for testing the bonding strength of anchors. The maximum load capacity of SMT is 1.4 N, and the minimum resolution is 10 μN at a range of 450 mN. Silicon micro-cantilever specimens with one end anchored on glass were fabricated for this test. In order to simulate shear failure and torsion failure, SMT applied a force through a probe to push micro-cantilevers at the fixed-end and free-end respectively until they failed. The corresponding critical loads were recorded for calculating the bonding strength of different specimens. A microscope was set in front of the specimen to capture the whole test process. The rupture occurs in glass or silicon respectively for different samples. This novel technique provides an effective solution for determining bonding strength in MEMS (micro-electro-mechanical system) devices, and it also can be used to evaluate the strength of micro-cantilevers or micro-bridges.

关 键 词：微电子机械系统 键合 微悬臂梁 强度 

分 类 号：O334[理学—一般力学与力学基础]