镀镍整平剂整平能力的阳极溶出法测量  

MEASUREMENT ON LEVELING ABILITY OF LEVELING AGENTSIN NICKEL PLATING WITH ANODE DISSOLVING METHOD(ADM)

作　　者：陈义勤[1] 谢文磊[1] 

机构地区：[1]郑州粮食学院

出　　处：《河南科学》1995年第1期43-48,共6页Henan Science

摘　　要：采用阳极溶出法，利用旋转园盘电极的高低转速状态模拟微观不平整表面的峰谷处，对镀镍整平剂的整平能力进行了测量。结果表明，该方法同传统的用镀层金相显微照片计算整平能力的方法测量结果一致，并且简便、易于操作。在Ｗａｔｔｓ镀液中分别添加整平剂香豆素和硫脲，测得香豆素和硫脲的整平最佳浓度分别为０．３ｇ／ｌ和０．１６ｇ／ｌ。uthors have ineasured the leveling ability of leveling agents in nickel plating, using an-ode dissolving method(ADM) and rotating disc electrode (RDE), imitating the peak andgorge of unleveled surface with the high and low rotating speed of RDE respectively. It wasshown that the results of ADM are in agreement with those of metallic mierography method(MMM) and ADM is more convenient for operation. The results showed that the best concen-tration of coumarin and thiourea is 0.3 g / l and 0. 16g / l respectively.

关 键 词：整平能力 阳极溶出法 测量 镀镍 整平剂 

分 类 号：TQ153.12[化学工程—电化学工业]