磁控溅射材料沉积速率的定标方法的研究  

Calibrating method of magnetron sputtering materials deposition rate

作　　者：吴文娟[1] 王占山[1] 张众[1] 王洪昌[1] 王风丽[1] 秦树基[1] 陈玲燕[1] 

机构地区：[1]同济大学精密光学工程技术研究所,上海200092

出　　处：《光学技术》2005年第4期537-539,共3页Optical Technique

基　　金：国家自然科学基金资助项目(60378021);上海市科技发展基金资助项目(022261049;0352nm090)

摘　　要：介绍了一种利用磁控溅射制备多层膜速率的定标方法。用高精度磁控溅射镀膜设备在同一块基片上先后镀制了两种周期的多层膜,用X射线衍射仪对其进行掠入射衍射测量,测量数据经线性拟合,可同时求得两种多层膜的周期,进而得到镀膜速率。与常用的定标方法相比,该方法不仅可以得到与常用定标方法相同的实验结果,而且提高了工作效率。A new method of calibrating the deposition rate of the materials was introduced when fabricating the multilayers with the magnetron sputtering equipment. Two different period multilayers were coated on the same substrate with the high precision magnetron sputtering equipment. The samples were measured with the X-ray diffractometer at the grazing angle. Then the measuring data were dealt with linear fitting. Two different periods of the multilayers are gotten, and the deposition rates are calculated. Compared with the normal calibrating method, the new method can get the nearly similar results, and high efficiency.

关 键 词：多层膜 磁控溅射 定标 

分 类 号：O484.41[理学—固体物理] O434.12[理学—物理]