苏州三星半导体封装工艺及产品可靠性保障体系  

Assembly Process and Product Reliability Assurance System In Samsung Suzhou Semiconductor

作　　者：许华平[1] 王明湘[1] 

机构地区：[1]苏州大学电子信息学院微电子学系

出　　处：《电子与封装》2005年第8期41-46,共6页Electronics & Packaging

摘　　要：本文首先介绍苏州三星半导体的产品发展趋势和品质保障体系,着重阐述了四个关键封装工艺中的重要特性的管理方法和注意事项。然后介绍了产品可靠性实验的几个主要实验项目的实验目的、实验条件和要求。最后介绍了一些有关最新的无铅产品的可靠性保证方面的内容。First, in this paper we introduce the growing trend of the products and the quality assurance system in Samsung Electronic Suzhou Semiconductor, Then we introduce the key points of the management method of the quality system, especially on the four key steps in the package process. For the reliability tests, the main test conditions, requirement and the scope of the tests are reviewed. Finally we introduce some contents about the reliability ensure for the lead-free products.

关 键 词：封装工艺 可靠性 无铅化 

分 类 号：TN306[电子电信—物理电子学]