从有铅向无铅焊接过渡阶段应注意的问题  

Application and Development of Surface Mount Technology

作　　者：顾霭云[1] 赵东明[2] 曹白杨[3] 

机构地区：[1]公安部第一研究所,北京100000 [2]廊坊师范学院,河北廊坊065000 [3]北华航天工业学院电子工程系,河北廊坊065000

出　　处：《华北航天工业学院学报》2005年第3期1-5,9,共6页Journal of North China Institute of Astronautic Engineering

摘　　要：目前正处于从有铅向无铅焊接过渡的特殊阶段,无铅材料、印制板、元器件、检测、可靠性等方面都没有标准,无铅工艺方面在国内处于比较混乱的阶段。本文较全面地分析了无铅焊接的现状、无铅焊接的特点和对策、无铅焊接存在的主要问题,以及过渡阶段有铅、无铅混用应注意的问题。It is in the special stage to transfer from lead solder to lead-free solder. The things such as lead-free material, PCB,component,examination and reliability have no common standard. In this paper, the actuality of lead-free solder and its characteristics and countermeasures are introduced in detail, otherwise, the main problems of lead-free solder and the problems when lead solder and leadfree solder were used together that should be paid attention to during the transfer stage are also analyzed entirely.

关 键 词：无铅焊接 无铅元器件 无铅印制板 无铅可靠性 

分 类 号：TN705[电子电信—电路与系统]