LTCC及其在三维微波集成电路中的应用  

LTCC and Its Application for Three Dimensional Microwave Integrated Circuits

作　　者：魏启甫[1] 孟庆鼐[1] 郑建彬[1] 

机构地区：[1]合肥工业大学计算机与信息学院,合肥230009

出　　处：《微波学报》2005年第5期58-62,70,共6页Journal of Microwaves

摘　　要：介绍了用于三维微波集成电路(3D-MIC)的新技术LTCC(低温共烧陶瓷)的物理性能及主要特点;阐述了LTCC的制作工艺;重点讨论了基于LTCC的三维微波集成电路和内埋无源元件技术。This paper introduces physical properties and major characteristics of LTCC （ low temperature cofired ceramic）, which is a new technology used for three dimensional microwave integrated circuits（ 3D - MIC）. Schedule drawing of LTCC is presented. Emphasis is placed on LTCC - based 3D - MIC and technology of embedded passive components.

关 键 词：低温共烧陶瓷 三维微波集成电路 内埋无源元件 工艺流程 微波集成电路 LTCC 三维 应用 物理性能 制作工艺 

分 类 号：TN454[电子电信—微电子学与固体电子学] TN405