Monolithic Integration of InGaP/AlGaAs/InGaAs Enhancement/Depletion-Mode PHEMTs  

GaAs基单片集成InGaP/AlGaAs/InGaAs增强/耗尽型PHEMTs(英文)

作　　者：李海鸥[1] 张海英[1] 尹军舰[1] 叶甜春[1] 

机构地区：[1]中国科学院微电子研究所,北京100029

出　　处：《Journal of Semiconductors》2005年第12期2281-2285,共5页半导体学报（英文版）

基　　金：国家自然科学基金(批准号:60276021);国家重点基础研究发展规划(批准号:G2002CB311901)资助项目~~

摘　　要：The monolithic integration of enhancement- and depletion-mode （E/D-mode） InGaP/AIGaAs/InGaAs pseudomorphic high electron mobility transistors （PHEMTs） with a 1.0μm gate length is presented. Epilayers are grown on SI GaAs substrates using MBE. For this structure, a mobility of 5410cm^2/（V · s） and a sheet density of 1.34 × 10^12 cm^-2 are achieved at room temperature. During the gate fabrication of E/D-mode PHEMTs,a novel twostep technology is applied. The devices with a gate dimension of 1μm × 100μm exhibit good DC and RF performances. Threshold voltages of 0. 2 and -0. 4V,maximum drain current densities of 300 and 340mA/mm,and extrinsic transconductances of 350 and 300mS/mm for E- and D-mode PHEMTs are obtained, respectively. The reverse gatedrain breakdown voltage is -14V for both E- and D-mode. Current-gain cutoff frequencies of 10. 3 and 12.4GHz and power-gain cutoff frequencies of 12.8 and 14.7GHz for E- and D-mode are reported, respectively.提出了一种新结构单片集成增强/耗尽型(E/D)InGaP/AlGaAs/InGaAs赝配高电子迁移率晶体管(PHEMTs).外延层材料通过分子束外延技术生长,在室温下,其电子迁移率和二维电子气浓度分别为5410cm2/(V·s)和1.34×1012cm-2.首次提出了普通光学接触曝光分步制作增强与耗尽型的栅技术方法.研制出了单片集成E/D型PHEMTs,获得良好的直流和交流特性,最大饱和漏电流密度分别为300和340mA/mm,跨导为350和300mS/mm,阈值电压为0.2和-0.4V,增强型的fT和fmax为10.3和12.4GHz,耗尽型的fT和fmax为12.8和14.7GHz.增强/耗尽型PHEMTs的栅漏反向击穿电压都为-14V.

关 键 词：pseudomorphic high electron mobility transistors ENHANCEMENT-MODE DEPLETION-MODE threshold voltage GAAS 

分 类 号：TN322[电子电信—物理电子学]