底充胶导热系数预测及对倒装焊温度场的影响  

Thermal conductivity prediction of underfill and its affects on the flip chip temperature field

作　　者：马孝松[1] 陈建军[1] 

机构地区：[1]西安电子科技大学机电工程学院

出　　处：《西安电子科技大学学报》2006年第1期103-106,155,共5页Journal of Xidian University

基　　金：国家自然科学基金资助项目(60166001)

摘　　要：根据导热的基本理论和Haiying L i的研究数据拟合出填加了碳纤维、S ilica的环氧树脂封装材料的导热系数预测公式,依此公式可预测出相关复合材料的导热系数.利用有限元方法对电子封装倒装焊中不同导热系数的底充胶材料对温度场的影响进行了分析比较.表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差,降低底充胶的热应力,进而提高电子封装的可靠性.According to the thermal conductivity theory and Haiying Li＇s researching data, a prediction formula, which can be used to predicate the thermal conductivity of carbon fiber, silica and epoxy mixed packaging composite, is obtained. Finite element analysis is used to compare temperature differences between low and high thermal conductivity of composites. And research shows that high thermal conductivity composite can decrease the temperature difference of underfill between chip and substrate, so that it can improve the temperature distribution of the flip chip, decrease the thermal stress of underfill and increase packaging reliability.

关 键 词：导热系数 微电子封装 复合材料 底充胶 倒装焊 

分 类 号：TN605[电子电信—电路与系统] TK124[动力工程及工程热物理—工程热物理]