BGA植球机三维计算机辅助模块化设计  

Three dimensional computer aided design for BGA semiconductor packaging machine

作　　者：王晶[1] 夏链[1] 戴文明[1] 韩江[1] 

机构地区：[1]合肥工业大学,合肥230009

出　　处：《现代制造工程》2006年第3期43-45,共3页Modern Manufacturing Engineering

基　　金：合肥工业大学科学研究发展基金资助(050205F)

摘　　要：球栅阵列(BGA)封装能很好地满足IC芯片引脚数越来越多、IC尺寸越来越小的要求,成为新的IC封装技术主流。分析BGA植球机的工艺过程和工作原理,完成该设备的机械部分设计。在对BGA全自动植球机进行运动仿真后,可以确定各个机构运动正常。所设计的STAR-04Z型BGA全自动植球机产品样机能够满足市场的功能需求。The Ball Grid Array（BGA） can meet the request that the pin numbers of IC becomes more and more and the size ot IC becomes more and more small and becomes the leading method of IC packaging. Includes the technics＇process and working theory of the BGA semiconductor packaging machine. And the design of mechanics of the machine has been achieved. After imitating the motion of the machine, can make sure that the movement of each organization can carry out normally. And the model machine can meet the need of the market enough.

关 键 词：球栅阵列 半导体封装 机械设计 运动仿真 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]