微电子工业中清洗工艺的研究进展  

Research Progress of Wafer Cleaning in Microelectronics Industry

作　　者：韩恩山[1] 王焕志[1] 常亮[1] 胡建修[1] 

机构地区：[1]河北工业大学化工学院应用化学系,天津300130

出　　处：《微电子学》2006年第2期182-186,共5页Microelectronics

摘　　要：简要介绍了硅片表面污染物杂质的类型,综述了传统湿法清洗及干法清洗对硅片表面质量的影响,以及近年来清洗技术和理论的研究发展及现状;同时,阐述了污染物检测方法的研究进展;最后,对今后微电子清洗工艺的发展方向进行了展望。A brief introduction is made on the contamination of Si surfaces by organic species. Different effects of the conventional cleaning and dry cleaning on the quality of Si surfaces are summarized. The research of cleaning theory and development of cleaning techniques in recent years are reviewed. And, methods for contamination detection are also described. Finally, the developing trend of cleaning technologies for microelectronics is discussed.

关 键 词：半导体工艺 湿法清洗 干法清洗 检测 

分 类 号：TN405[电子电信—微电子学与固体电子学]