微电子封装无铅钎焊的可靠性研究  

Reliability of lead-free solder welding in micro-electronics packaging

作　　者：梁凯[1] 姚高尚[1] 简虎[1] 熊腊森[1] 

机构地区：[1]华中科技大学材料学院,湖北武汉430074

出　　处：《电焊机》2006年第5期18-21,共4页Electric Welding Machine

摘　　要：微电子封装材料的无铅化就是目前微电子封装技术的发展方向之一,微电子封装材料的无铅化对产品的质量可靠性带来的影响与有铅钎料封装时代不同,所以对此影响进行研究,并据此选择产品生产过程中合适的无铅钎料,制定适当的生产工艺评估标准来提高产品的可靠性有着较大的现实意义。阐述了微电子封装采用无铅钎料的必要性,概述了无铅钎料的研究现状,并着重分析讨论了微电子封装无铅钎焊的可靠性问题。Lead-free is one of the developments direction of the microelectronics packaging,which brings about some influences on products＇ reliability,different from lead packaging.So,it＇s necessary to analyze those influences,and choose appropriate lead-free solder materials as well as stablish the process technics to improve the products＇ reliability.In this paper,the importance of lead-free solder material applied in microelectronics packaging industry is explained,especially for the reliability of lead-free solder in microelectronics packaging industry.

关 键 词：无铅钎料 无铅钎焊 微电子封装 可靠性 

分 类 号：TG40[金属学及工艺—焊接]