从BUM看厚膜网版印刷技术的新发展(一)  

Looking at New Development of Thick Film Stencil Printing Technology from BUM(Part 1)

作　　者：熊祥玉 邱耀光 

机构地区：[1]深圳市科精诚网印机械有限公司

出　　处：《丝网印刷》2006年第6期4-9,共6页Screen Printing

摘　　要：当前电子制造技术的飞速变化:PCB从安装基板向封装载板发展、PCB与SMT的结合势在必行以及SMT与电子封装工程的界限越来越模糊。随着厚膜网版印刷技术的新发展,电子制造技术将不断改进,重点介绍了BUM中的厚膜网版印刷技术。This article introduces the advance of PCB manufecturing technology from base plate to carrier plate enciosing and mounting.To combine PCb with SMT technology,the limit between SMT and electronic packaging project is getting more and more unclear.With the rapid development of electronic manufacturing technology.thick stencil process will be used widely.It emphasized on thick stencil printing technology in BUM.

关 键 词：电路板 积层多层板 厚膜版 网版印刷 

分 类 号：TS871.1[轻工技术与工程]