无铅焊接中Lift-off现象产生的原因及抑制对策  

The Causes of and the Countermeasures Against the Lift-off Phenomenon Occured in Lead-Free Wave Soldering

作　　者：李元山[1] 陈旭[1] 

机构地区：[1]国防科技大学计算机学院,湖南长沙410073

出　　处：《计算机工程与科学》2006年第7期105-108,共4页Computer Engineering & Science

摘　　要：本文首次提出三要素法来解释Lift-off的形成机理。相比传统的“Bi-Segregation”失效机理,“三要素法”可以解释含Bi和不含Bi的所有无铅钎料产生或不产生Lift-off的原因,并由此找出了Lift-off的抑制对策。This paper puts forth the ＂three-factor method＂for the first time to explain the forming mechanism of lift-off. Compared with the traditional ＂Bi-Segregation＂ invalidation mechanism, the＂three-faetor method＂ can explain the causes of lift-off formed or non-formed by all lead-free solders with and without bismuth. Finally, the restraining countermeasures against lift-off are also given.

关 键 词：无铅钎料 波峰焊 LIFT-OFF 三要素法 

分 类 号：TG44[金属学及工艺—焊接]