多芯片组件布局布线设计的新途径  

A new approach to the placement and routing design for MCM

作　　者：畅艺峰[1] 杨银堂[1] 

机构地区：[1]西安电子科技大学微电子所/宽禁带半导体材料与器件教育部重点实验室,陕西西安710071

出　　处：《西北大学学报（自然科学版）》2006年第4期547-550,共4页Journal of Northwest University（Natural Science Edition）

基　　金：国防预研基金资助项目(41323020204)

摘　　要：目的MCM布局布线设计的封装设计库不能满足具体MCM设计的要求,本文针对这一问题进行研究。方法首先对零件库加以扩充,并研究MCM多层布线基板设计等问题,为布局布线做准备。结果采用本文的方法,对检测器电路实例进行了布局布线设计,可以满足具体电路布局布线设计要求。结论本文的方法是多芯片组件布局布线设计的一种可行方法。Aim Due to the short of the packaging library, it needs to present how to achieve the placement and routing in MCM. Methods The library is developed firstly, then an eight-layer substrate is designed which is the basis of MCM placement and routing design. Results On the basis of it, the placement and routing design of an example is given to illustrate the development of the library and multiplayer substrate design, which can meet the requirements. Conclusion The method discussed in this paper is proved feasible.

关 键 词：多芯片组件 封装 基板 布局布线 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]