多层陶瓷电容器可镀银端头浆料  

Platable Ag Termination Pastes Used on Chip Multilayer Ceramic Capacitors Yu Shougeng;Ren Jinyu;Chen Qiao and Yang Wen

作　　者：俞守耕[1] 任金玉[1] 陈峤[1] 杨雯[1] 

机构地区：[1]昆明贵金属研究所

出　　处：《贵金属》1996年第4期6-10,共5页Precious Metals

摘　　要：对①Ａｇ粉、Ａｇ＿２Ｏ、片状Ａｇ粉和主晶相为ＰｂＺｎＳｉＯ＿４的玻璃—陶瓷粉及②Ａｇ粉、片状Ａｇ粉、ＣｕＯ和ＣｄＯ固体混合料都用聚乙烯醇缩丁醛─树脂─松油醇有机体系配制成两种可镀Ａｇ端头浆料。烧结温度分别为７８０℃和８７０℃。端电极外观好，无尖峰、沟槽、针孔等缺陷。电镀的片式ＭＬＣ的性能达到ＧＢ、ＩＥＣ有关标准的技术条件。Two platable Ag termination pastes have been formulated by adding polyvinyl butyral-resin-terpineol organic systems to solid mixing materials:(1)Ag powder,Ag2O,Ag flake and glass-ceramic powder having PbZnSiO4as main crystal phase,and;(2)Ag powder,Ag flake,CuO and CdO. The firing temperature are 780℃ and 870℃ respectively.The terminal electrodes have showed fine cosmetics without defects such as peaks,furrows,pinholes and so on. Technical data on chip M LC after plating achieve requirements defined in criteria GB,IEC.

关 键 词：镀银 多层陶瓷电容器 端电极 浆料 电容器 

分 类 号：TM534.103[电气工程—电器]