微电子封装与电子整机的微小型化进程  

The Development of Micro-electronics Packaging Technology and Microminiaturization of Electronic Equipment

作　　者：胡先进[1] 

机构地区：[1]安徽四创电子股份有限公司,合肥230088

出　　处：《电子与封装》2006年第12期1-3,共3页Electronics & Packaging

摘　　要：电子整机的微小型化体现在其尺寸小、厚度薄、重量轻上,体现在它们的高性能、多功能、高可靠、便携化、卡片化上;而达到这些性能的关键及基础是适应电子整机需要的微电子封装技术的不断进步,用先进封装技术“武装”各类电子整机。二者密切结合、相互促进、协同发展、共同提高,引领着电子整机微小型化发展的大趋势。文章沿着微电子发展的脉络论述了二者向更高阶段发展的必由之路。The microminiaturization of electronic equipments incarnate on short, small, light for its size, thickness and the weight, Also incarnate on its high-performance, multifunction, high-reliability and portability. One key to achieve the above performances is the advanced micro-electronics packaging technology applied on the various electronic equipments. And the electronic equipments combined with the advanced micro-electronics packaging technology will accelerate the development of the microminiaturization. This article is expatiating the way to the higher-stage development of the micro-electronics packaging technology and the microminiaturization of electronic equipments,

关 键 词：先进封装 BGA/CSP FC MCM 3D SIP/SOP MEMS 

分 类 号：TN305.94[电子电信—物理电子学]