高导热聚合物基复合封装材料及其应用  

Electronic Packaging Technology and Polymer-based Composite Packaging Materials

作　　者：何洪[1] 傅仁利[1] 沈源[1] 韩艳春[1] 宋秀峰[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《电子与封装》2007年第2期7-10,共4页Electronics & Packaging

基　　金：国家自然科学基金资助项目(批准号:50472019)

摘　　要：微电子封装密度的提高对传统环氧塑封料的导热性能提出了更高的要求,将高导热的陶瓷颗粒/纤维材料添加到聚合物塑封材料中可获得导热性能好的复合型电子封装材料。文章结合高导热环氧塑封材料的研究工作,评述了高热导聚合物基复合封装材料的材料体系、性能特点和在微电子封装中的应用情况。分析讨论了影响聚合物基复合电子封装材料导热性能和介电性能的因素,提出了进一步提高聚合物基复合电子封装材料导热性能的途径。Traditional epoxy packaging materials are required for higher performance with the micro electronic packaging density increasing. Composites with high thermal conductivity can be fabricated by addition of ceramic particles or fiber into polymers, and can be used as electronic packaging materials. Companying with research in highly thermal conductive epoxy packaging materials, material system, performance and applicabil- ity in electronic packaging of polymer composite are discussed respectively. Factors which influence the thermal conductance and dielectric property of such kind of composite packaging materials are analyzed. Several methods for improving the thermal conductive performance of these composites are discussed.

关 键 词：电子封装 聚合物基复合材料 导热性能 应用 

分 类 号：TN305.94[电子电信—物理电子学]