南瓜脆片制作工艺的研究  

Study on the Processing Technology of Fried Pumpkin Chips

作　　者：李焕荣[1] 古丽娜孜[1] 陆阳[1] 涂晓君[1] 

机构地区：[1]新疆农业大学食品科学学院,新疆乌鲁木齐830052

出　　处：《农产品加工（下）》2007年第2期26-29,共4页Farm Products Processing

基　　金：新疆农业大学校长基金项目(2005)

摘　　要：以南瓜粉和玉米淀粉为主要原料,从原料的配比和成型条件等方面对南瓜脆片的制作工艺进行了研究。确定了南瓜脆片的制作工艺、主要工艺条件和配方,并对产品的含水量、酥脆度、色泽和外形的平整性等品质特性进行了评价。南瓜脆片的最佳配方为:南瓜粉47%,玉米淀粉31%,糯米粉12%,乳化剂0.6%,增稠剂0.49%;最佳工艺条件为:南瓜切片厚度为2mm,含水量为8%,油炸温度为120℃,油炸时间为10s,产品具有香、酥、脆的特点。The pumpkin powder and maize starch as major material, the processing technology of fried pumpkin chips was studied in this thesis. According to the experiment, the processing technology and the major processing conditions were determined. The quality of fried pumpkin chips was evaluated according to the moisture content, crispness, color and the shape. The optimum formula were： 47% pumpkin powder, 31%corn starch, 12% glutinous rice flour, 0.6% emulsifier, 0.49% glutin; the optimum process condition of the pumpkin chips were： the thickness of slices 2mm; moisture content 8%; the temperature of deep-fry 120℃ ; fry time 10s. The product is crisp, fragrant and pleasant to taste.

关 键 词：南瓜脆片 工艺条件 品质 

分 类 号：TS201.1[轻工技术与工程—食品科学]