微细群电极的加工及其封装技术  

Application of Micro-electrode Array and its Machining Encapsulation Technology

作　　者：曾伟梁[1] 王振龙[1] 

机构地区：[1]哈尔滨工业大学机电工程学院

出　　处：《电加工与模具》2007年第1期6-9,33,共5页Electromachining & Mould

摘　　要：介绍了微细群电极的应用情况,分别给出了LIGA方法、电火花超声复合反拷加工法和电火花线切割加工法制作群电极的工作原理,并对这些工艺的特点进行了归纳,给出了具有代表性的加工实例,最后介绍了微细群电极的封装技术。The definition of micro-electrode array is given, its concrete application is presented. The working mechanism of technologies for micro-electrode array fabrication, include LIGA, micro- EDM enhanced by ultrasonic vibration and micro-WEDM, are introduced, their advantages and disadvantages are summed up, representative machining examples are given. At last, the encapsulation technology of micro-electrode array is introduced.

关 键 词：微细群电极 LIGA 电火花加工 封装 

分 类 号：TG661[金属学及工艺—金属切削加工及机床]