AlSiC电子封装材料及器件物理性能研究进展  

Advancement in Physical Property of Aluminum Silicon Carbide Electronic Packaging Composites

作　　者：熊德赣[1] 刘希从[1] 程辉[1] 白书欣[1] 杨盛良[1] 卓钺[1] 赵恂[1] 

机构地区：[1]国防科技大学航天与材料工程学院,湖南长沙410073

出　　处：《中国材料科技与设备》2007年第1期25-29,共5页Chinese Materials Science Technology & Equipment

摘　　要：AlSiC电子封装材料及器件的关键指标是膨胀系数、热导率和气密性。不同工艺条件下制备的AlSiC电子封装材料物理性能相差较大。尽管已建立一些理论模型预测AlSiC电子封装材料的膨胀系数和热导率，但由于基体塑性变形、粘接剂类型及含量、粉末尺寸等许多因素影响，理论结果与实验结果相差较大。热循环过程中，基体合金类型、增强体尺寸、预处理方法和热循环次数等明显影响AlSiC电子封装材料的尺寸稳定性。温度循环对AlSiC电子封装材料物理性能的影响尚未见公开报道。The coefficient of thermal expansion （C/E）, thermal conductivity （TC） and herraeficity were the crucial properties for aluminum silicon carbide electronic packaging materials （ AlSiC composites） and components. The physical properties of AlSiC manufactured by distinct processes technology were varied much.Several theoretical model is have been presented in the literature which give expressions for the CTE and TC of metal matrix composites, but the experimental and theroretical results were not identical because of they are influ- enced by several factors, such as matrix plasticity, binder and SiC/binder ratio and size of SiC. Different matrix, particle dimension, preheat treatment method and different thermal cycling times have great influence on the dimensional stability of AlSiC composites during the course of thermal cycling. The effect of temperature cycling on the properties of AlSiC was not reported openly in literature.

关 键 词：AlSiC电子封装材料 膨胀系数 热导率 尺寸稳定性 温度循环 

分 类 号：TB3[一般工业技术—材料科学与工程]