MEMS器件真空封装工艺、装备及真空度检测的研究  

Research on Vacuum Packaging Process,Equipment and Vacuum Degree Detection of MEMS Devices

作　　者：汪学方[1] 林栋[1] 甘志银[1] 刘胜[1] 张鸿海[1] 

机构地区：[1]华中科技大学,武汉430074

出　　处：《中国机械工程》2007年第8期887-890,共4页China Mechanical Engineering

基　　金：国家863高技术研究发展计划资助项目(2005AA404260)

摘　　要：开发了一台利用电阻焊实现MEMS器件真空封装的设备,探索了内部真空度在10Pa以下的MEMS器件的真空封装工艺,即一次压力为0.4MPa、二次压力为0.6MPa、充电电压为325V时封装质量最好;研究了一种利用晶振测量真空度的方法,经试验,至少经两天老化后晶振的共振频率才能稳定;对7个真空封装器件进行高低温循环试验,其中有5个器件的真空度在三天后还保持在10Pa以下且趋于稳定,成品率达到71.43%。A equipment for MEMS vacuum packaging using resistance welding had been designed and manufactured,and a MEMS vacuum sealing process to get and hold vacuum degree lower than 10Pa had been investigated, packaging parameters of the best packaging quality are first pressure 0.4MPa,second pressure 0. 6MPa, charge voltage 325V. A method to detect vacuum degree using crystal resonator had been investigated, and resonant frequency of crystal resonator could be stabilized after two days aging test at least. Seven vacuum packaging devices had been tested by high-low temperature circle experiments,five devices of them starts holding vacuum degree lower than 10Pa after the fourth day,percentage of finished product reaches 71.43%.

关 键 词：电阻焊 真空封装 真空度检测 晶振 

分 类 号：TG438.2[金属学及工艺—焊接] TB771[一般工业技术—真空技术]