薄型IC封装用无卤素覆铜板基材  

Halogen-Free Substrate Material for Thin IC Packages

作　　者：张洪文 

出　　处：《覆铜板资讯》2007年第2期18-22,共5页Copper Clad Laminate Information

摘　　要：在研发成功低吸水性分子主链和捕捉金属离子型树脂的基础上,研制成功了绝缘可靠性优良的薄型IC封装用无卤素覆铜板基材。因为这种材料当绝缘层厚度为40μm时就有良好的绝缘可靠性,所以能实现厚度为100μm封装结构基板。而且在无卤素的情况下能达到UL94-V0级的阻燃性,并能做到符合环保要求的无铅焊锡装配。With the development of a resin with a low moisture absorption structure and capability of capturing metal ions ,a halogen-free material with outstanding insulation reliability has been developed for use with thin IC packages. This material has excellent insulation reliability even with an insulation thickness of 40 μm and is capable of achieving an interposer thickness of 100 μm. The environmentally friendly material has achieved a flame resistance of UL94-VO without containing halogen and is compatible with lead-free solder for packaging.

关 键 词：IC封装 无卤素 覆铜板 基材 薄型 绝缘可靠性 绝缘层厚度 离子型树脂 

分 类 号：TQ325.1[化学工程—合成树脂塑料工业]