微组装技术的发展  

Development of Micropackage Technology

作　　者：赵正平[1] 苏世民[1] 

机构地区：[1]电子工业部第十三研究所,石家庄050051

出　　处：《半导体情报》1997年第1期1-8,共8页Semiconductor Information

摘　　要：论述了目前高密度封装和 MCM 的现状。指出目前高密度封装和 MCM 技术正在从数字电路向模拟电路尤其是微波电路转移,并例举了几种常见的微波 MCM。还论述了近年来我所研制的一些微封装、微组装的典型产品。This paper describes the current status of MCM,and points out that at pre- sent the high-density packaging and MCM technologies are transferring from digital cir- cuit to anologue circuit,especially to microwave circuit.And some microwave MCMs are exemplified.Furthermore some typical products of micropackage and microassembly de- veloped in our Institute in recent years are addressed.

关 键 词：多芯片组件 封闭 微组装 

分 类 号：TN605[电子电信—电路与系统]