激光键合的有限元仿真及工艺参数优化  

Finite Element Simulation and Process Optimization of Localized Laser Bonding

作　　者：马子文[1] 汤自荣[1] 廖广兰[1] 史铁林[1] 聂磊[1] 周平[1] 

机构地区：[1]华中科技大学机械科学与工程学院武汉光电国家实验室,武汉430074

出　　处：《Journal of Semiconductors》2007年第6期995-1000,共6页半导体学报（英文版）

基　　金：国家重大基础研究(批准号:2003CB716207);国家自然科学基金(批准号:50405033)资助项目~~

摘　　要：在硅/玻璃激光键合中,温度场的分布是影响晶片能否键合的关键因素.本文利用有限元法建立了移动高斯热源作用下硅/玻璃激光键合的三维温度场数值分析模型.运用该模型计算了不同的工艺参数条件下硅/玻璃的温度场分布,并由此得出键合线宽.然后通过漏选试验确定影响激光键合的主要工艺参数有激光功率、激光扫描速度及键合初始温度.最后通过对仿真结果进行回归分析,得到激光键合工艺的最优参数,为进一步研究激光键合工艺提供了理论依据.The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method. In the model, the temperature distribution with different process parameters is simulated and the bondline width is obtained. Then the key process parameters of laser bonding, including laser power, scanning velocity, and in-itial temperature, are obtained with the help of scanning experiments. Finally, with regression analysis on the simulation re-sults, a regression model is made and the optimal process parameters of laser bonding are found. This can provide a theoretical basis for further study on laser bonding.

关 键 词：激光键合 有限元法 回归分析 键合线宽 

分 类 号：TN405[电子电信—微电子学与固体电子学]