基于LTCC技术的多层垂直转换电路设计  

Microstrip to Stripline Vertical Transition with LTCC Technology

作　　者：周骏[1] 沈亚[1] 戴雷[1] 王子良[1] 李拂晓[1] 

机构地区：[1]单片集成电路与模块国家重点实验室南京电子器件研究所,南京210016

出　　处：《电子与封装》2007年第7期14-16,23,共4页Electronics & Packaging

摘　　要：低温共烧陶瓷(LTCC)是实现小型化、高可靠性多芯片组件的一种理想技术方式。多层转换电路实现了微波信号在基板内部传输。文章研究了微带线到带状线背靠背式多层转换电路,优化设计了通孔之间距离以及通孔到带状线之间的距离,仿真结果与实测较为吻合。Low temperature co-fired ceramic（LTCC）is a realistic technology for realizing miniature and high reliable multichip module.Multilayer transition circuit make the microwave signal transmit in the substrate.A novel microstrip to stripline vertical transition is proposed in this paper.The distance between the vias and distance from via to stripline has being optimized by HFSS to improve the RF performance. The presented design was simulated and validated by measured.

关 键 词：低温共烧陶瓷 垂直转换 网格地平面 三线结构 

分 类 号：TN402[电子电信—微电子学与固体电子学]