高密度互连技术及HDI板用材料的研究进展  

Advances of High Density Interconnect and Its Materials

作　　者：刘德林[1] 成立[1] 韩庆福[1] 李俊[1] 徐志春[1] 张慧[1] 

机构地区：[1]江苏大学电气与信息工程学院,江苏镇江212013

出　　处：《半导体技术》2007年第8期645-649,共5页Semiconductor Technology

基　　金：江苏省高校科研成果产业推进工程计划项目(JHZD06-42)

摘　　要：为了适应电子产品向更轻、更小、更薄、可靠性更高的方向发展,电子封装对高密度互连(HDI)技术提出了更高的要求。HDI技术在ULSI中用来缩小尺寸、减轻重量和提高电气性能。综述了先进的HDI技术及其应用概要,分析了HDI制造工艺中的几种成孔方法,其中包括HDI线路通导的方式和纳米精细线路的制作工艺,阐述了HDI板用积层材料的发展方向以及两种新型的HDI板用材料:液晶聚合物和AS-11G树脂。以通孔微小化和导线精细化等为核心的HDI技术满足了电子封装技术不断提高封装密度的需要,将成为下一代PCB的主流技术。For the development of electronic devices to be lighter, smaller, thinner and more reliable, the electronic packagings set a higher request to HDI technology. The HDI technology is used to reduce the size and the weight, enhance the electrical characteristics in ULSI. Advanced HDI technologies and their applications are summarized, and forming methods of micro via for HDI manufacturing process are also analyzed. Then line passing methods and nanometer fine line manufacturing technologies of HDI are discussed. Development prospects of HDI PCB materials, including liquid crystal polymer and AS-11G resin, are elaborated. The HDI technology meets the ever-increasing demands of the packaging-density of the electronic packaging technology, and will become the major technology for the next generation PCB.

关 键 词：高密度互连 通孔 激光成孔 纳米精细线路 液晶聚合物 AS-11G树脂 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]