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作 者:于洋[1] 史耀武[1] 夏志东[1] 雷永平[1]
机构地区:[1]北京工业大学材料科学与工程学院,北京100022
出 处:《电子元件与材料》2007年第10期57-59,76,共4页Electronic Components And Materials
基 金:国家"863"计划资助项目(No.2002AA322040);北京市教委"环境协调连接材料与加工技术"学术创新团队计划资助项目
摘 要:分别通过流体力学计算、数值模拟及实验方法研究在不同压力作用下生产电子封装用锡球时不同喷嘴的射流速度。对比分析表明,理论计算和模拟与实验结果基本相符;理论计算方法较方便、准确计算出射流出口的平均速度,数值模拟方法不但可求得平均速度,而且可得到射流断面的速度分布。保持喷嘴直径不变,射流速度随压力增加而呈抛物线形增加。在相同压力作用下,射流速度随喷嘴直径增加而稍有增加,随过渡段直径增加而减小,并且压力差越大增加值或减小值也越大。Jet velocity of different nozzle under varying pressure difference was computed by theoretical analysis, numerical simulation and experimental method. The results show that the compulational results and simulation results agree with the experimental results very well. Analytical method can get average jet velocity easily. Simulation method can not only get the average jet velocity, but also get more important information such as velocity distribution and pressure distribution. When keep the nozzle diameter, jet velocity increases by parabola form with the increasing of pressure difference. Under the same pressure difference, jet velocity increases slightly with the increasing of the nozzle diameter, but decreases with the increasing of the diameter of transition section, and higher pressure difference produces lager difference value.
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